Sains Malaysiana 49(12)(2020): 3073-3080

http://dx.doi.org/10.17576/jsm-2020-4912-19

Effect of Temperature on Strain-Induced Hardness of Lead-Free Solder Wire using Nanoindentation Approach

(Kesan Suhu terhadap Kekerasan Terikan Teraruh Wayar Pateri Bebas Plumbum menggunakan Pendekatan Pelekukan Nano)

NORLIZA ISMAIL^1,2, MARIA ABU BAKAR²* & SAIFUL BAHARI BAKARUDIN²

¹Department of Applied Physic, Faculty of Science & Technology, Universiti Kebangsaan Malaysia, 43600 UKM Bangi, Selangor Darul Ehsan, Malaysia

²Institute of Microengineering and Nanoelectronics (IMEN), Universiti Kebangsaan Malaysia, 43600 UKM Bangi, Selangor Darul Ehsan, Malaysia

Diserahkan: 18 Ogos 2020/Diterima: 28 Ogos 2020

ABSTRACT

Hardness properties of SAC305 solder wire under tensile test at varied temperature was investigated. Continuous multi-cycle (CMC) nanoindentation technique with ten cycle of indentation for each sample was performed to evaluate the hardness behaviour of SAC305 solder wire at different depth of indentation. As a result, all investigated SAC305 solder wire under constant strain rate of tensile test and at different temperature revealed the occurrence of indentation size effect (ISE). At initial cycle of indentation, SAC305 solder wire at room temperature (25 °C) have higher hardness value compared to the others sample which exposed to the varied temperature during tensile test. Besides, higher temperature causes the higher strain or elongation to the SAC305 solder wire. Applied of strain during the tensile test had generated the pre-dislocation activity in the SAC305 solder wire. Therefore, higher hardness values of SAC305 at room temperature is due to the existence of high dislocation density induced by the applied strain. Nevertheless, the existence of heat at 60, 90, 120 and 180 °C during the tensile test prompt the rearrangement of dislocation and reduce the dislocation activities, thus, allowing higher elongation of solder wire.

Keywords: Continuous multi-cycle nanoindentation; hardness; lead-free solder; strain-induced; tensile test

ABSTRAK

Sifat kekerasan wayar pateri SAC305 di bawah ujian tegangan pada suhu yang berbeza telah dikaji. Teknik pelekukan nano multi-kitaran berterusan dengan sepuluh kitaran pelekukan bagi setiap sampel telah dijalankan untuk menilai kelakuan kekerasan wayar pateri SAC305 pada kedalaman pelekukan yang berbeza. Keputusannya, kesemua wayar pateri SAC305 yang dikaji di bawah kadar terikan yang malar dan pada suhu yang berbeza menunjukkan berlaku kesan saiz pelekukan (ISE). Pada kitaran awal pelekukan, wayar pateri SAC305 pada suhu bilik (25 °C) mempunyai nilai kekerasan yang lebih tinggi dibandingkan dengan sampel lain yang didedahkan kepada suhu yang berbeza semasa ujian ketegangan. Suhu yang lebih tinggi menyebabkan terikan atau pemanjangan yang lebih tinggi terhadap wayar pateri SAC305. Terikan yang dikenakan semasa ujian tegangan telah menghasilkan aktiviti pra-kehelan pada wayar pateri SAC305. Oleh itu, nilai kekerasan yang lebih tinggipada wayar pateri SAC305 pada suhu bilik adalah disebabkan oleh kehadiran ketumpatan kehelan yang tinggi teraruh oleh terikan yang dikenakan. Walau bagaimanapun, kehadiran haba pada suhu 60, 90, 120 dan 180 °C ketika ujian tegangan menyebabkan penyusunan semula kehelan dan mengurangkan aktiviti kehelan serta membenarkan pemanjangan wayar pateri yang lebih tinggi.

Kata kunci: Kekerasan; pateri bebas-plumbum; pelekukan nano multi-kitaran berterusan; terikan-teraruh; ujian tegangan

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*Pengarang untuk surat-menyurat; email: maria@ukm.edu.my