Sains Malaysiana 49(12)(2020): 3255-3259

http://dx.doi.org/10.17576/jsm-2020-4912-36

 

Effect of Bismuth Additions on Wettability, Intermetallic Compound, and Microhardness Properties of Sn-0.7Cu on Different Surface Finish Substrates

(Kesan Penambahan Bismut kepada Kebasahan, Sebatian antara Logam dan Sifat Mikrokekerasan Sn-0.7Cu terhadap Substrat Akhir Berlainan Kemasan)

 

MOHD IZRUL IZWAN RAMLI1, MOHD ARIF ANUAR MOHD SALLEH1*, SITI FARAHNABILAH MUHD AMLI1 & NURUL RAZLIANA ABDUL RAZAK2

 

1Center of Excellence Geopolymer & Green Technology (CeGeoTech), School of Materials Engineering, Universiti Malaysia Perlis (UniMAP), Taman Muhibbah, 02600 Jejawi, Perlis, Malaysia

 

2Department of Mechanical Technology, Faculty of Engineering, Kampus UniCITI Alam Sungai Chuchuh, Padang Besar, 02100 Perlis, Malaysia

 

Diserahkan: 14 Ogos 2020/Diterima: 11 September 2020

 

ABSTRACT

The influence of bismuth (Bi) addition on wettability, thickness of interfacial intermetallic compound (IMC), and microhardness properties of Sn-0.7Cu + xBi solder alloy using different types of substrate were examined. The 0.5, 1.0, 1.5, and 2.0 wt. % Bi was added into Sn-0.7Cu and fabricated using the casting process. The result shows that the influence of 1.5 wt. % Bi in the Sn-0.7Cu solder soldered on copper organic solderability preservative (Cu-OSP) and immersion tin (Im-Sn) surface finish has improved the wettability and microhardness. Subsequently, the IMC thickness of Sn-0.7Cu+1.5Bi solder alloy on Im-Sn surface finish gives a better result than reflowed on Cu-OSP. Generally, with the addition of 1.5 wt. % Bi in Sn-0.7Cu solder alloy reflowed on the Im-Sn surface finish had enhanced the performance in terms of wettability, thickness of IMC and microhardness properties compared to on Cu-OSP surface finish.

 

Keywords: Bismuth; solder alloy; surface finish; wettability

 

ABSTRAK

Dalam kajian ini, kesan penambahan bismut (Bi) terhadap kebasahan, ketebalan antaramuka sebatian antara logam (IMC) dan sifat mikrokekerasan pateri bebas plumbum Sn-0.7Cu + xBi menggunakan pelbagai jenis substrat telah dikaji. Penambahan 0.5, 1.0, 1.5 dan 2.0 bt. % Bismut ke dalam Sn-0,7Cu dibuat menggunakan kaedah peleburan. Hasil kajian menunjukkan bahawa penambahan 1.5 bt. % Bi pateri Sn-0.7Cu yang dipaterikan pada permukaan Cu-OSP dan rendaman timah (ImSn) meningkatkan kebasahan dan mikrokekerasan. Selain itu, ketebalan IMC untuk pateri Sn-0.7Cu + 1.5Bi pada kemasan permukaan Im-Sn memberikan hasil yang lebih baik berbanding aliran semula pada permukaan pada Cu-OSP. Secara keseluruhan, dapat disimpulkan bahawa 1.5 bt. % Bi dalam pateri Sn-0.7Cu yang telah dialirkan semula pada permukaan ImSn telah meningkatkan ciri-ciri kebasahan, ketebalan IMC dan sifat mikrokekerasan berbanding pada permukaan Cu-OSP.

 

Kata kunci: Aloi pateri; bismut; kebasahan; kemasan permukaan

 

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*Pengarang untuk surat-menyurat; email: arifanuar@unimap.edu.my

   

 
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