Sains Malaysiana 48(6)(2019): 1273–1279
http://dx.doi.org/10.17576/jsm-2019-4806-15
Kesan Gelombang Kejutan
terhadap Sifat Mikromekanik Sambungan Pateri SAC 0307/ENiG menggunakan
Pendekatan Pelekukan Nano
(Effect of Shock Wave
on Micromechanical Properties of SAC 0307/ENiG Solder Joint using
Nanoindentation Approach)
MARIA ABU BAKAR1*, AZMAN JALAR1,2, WAN YUSMAWATI WAN YUSOFF3, NUR SHAFIQA SAFEE3, ARIFFIN ISMAIL3, NORLIZA ISMAIL1, EMEE MARINA SALLEH1 & NAJIB SAEDI IBRAHIM4
1Institut
Kejuruteraan Mikro dan Nanoelektronik (IMEN), Universiti Kebangsaan Malaysia, 43600
UKM Bangi, Selangor Darul Ehsan, Malaysia
2Pusat
Pengajian Fizik Gunaan, Fakulti Sains dan Teknologi, Universiti Kebangsaan
Malaysia, 43600 UKM Bangi, Selangor Darul Ehsan, Malaysia
3Pusat
Asasi Pertahanan, Universiti Pertahanan Malaysia 3, Kem Sungai Besi, 57000 Kuala
Lumpur, Wilayah Persekutuan, Malaysia
4Redring
Solder (M) Sdn. Bhd., Lot 17486, Jalan Dua, Taman Selayang Baru, 68100 Batu
Caves, Selangor Darul Ehsan, Malaysia
Diserahkan:
2 Januari 2019/Diterima: 28 Februari 2019
ABSTRAK
Kebolehharapan dan
kebolehtahanan pempakejan elektronik bagi peralatan elektronik dalam bidang
ketenteraan adalah menjangkaui kepenggunaan komersial. Kebolehharapan sambungan
pateri merupakan perkara asas bagi penilaian prestasi pempakejan elektronik.
Ujian kebolehharapan komersial atau konvensional seperti dalam standard JEDEC (Solid State Technology Association) tidak dapat memenuhi
keperluan pempakejan elektronik untuk piawaian ketenteraan. Kajian ini
melaporkan gerak balas sambungan logam pateri SAC 0307
pada papan litar bercetak (PCB) dengan kemasan permukaan
electroless nickel immersion gold (ENiG) terhadap gelombang kejutan hasil
daripada ujian letupan secara terbuka. Perubahan sifat mikromekanik dikaji
menggunakan pendekatan pelekukan nano. Gelombang kejutan yang berbeza dikenakan
pada sambungan pateri dengan menggunakan bahan Emulex dengan dos sebanyak 700 g
dan 1500 g. Kekerasan sambungan pateri telah menyusut sebanyak 29% daripada 141
MPa kepada 100 MPa selepas didedahkan pada gelombang kejutan dengan penggunaan
dos Emulex sebanyak 1500 g. Modulus terkurang sambungan pateri juga telah
menyusut sebanyak 13% daripada 141 GPa kepada 123 GPa dengan penggunaan dos
bahan Emulex sebanyak 1500 g. Ujian gelombang kejutan telah menyebabkan
berlakunya perubahan pada sifat mikromekanik sambungan pateri iaitu berlakunya
kelakuan perlembutan yang melibatkan penyusutan nilai kekerasan dan modulus
terkurang. Tiada retak diperhatikan pada antara sambungan pateri-substrat yang
menunjukkan bahawa sambungan pateri adalah tidak gagal dan tetap utuh selepas
didedahkan pada gelombang kejutan yang tinggi, walaupun berlaku penyusutan
sifat mikromekanik yang ketara.
Kata kunci: Bahan
pateri Sn-Ag-Cu; gelombang kejutan; pelekukan nano; sambungan pateri; sifat
mikromekanik
ABSTRACT
Reliability and durability
of electronic packaging for electronic equipment in military application
is beyond commercial applicability. The reliability of a solder
joint is a key point in assessing the performance of electronic
packaging. Commercial or conventional reliability testing such as
JEDEC (Solid
State Technology Association) standard is unable to fulfill the
electronic packaging requirement for military standards. This study
reported the response of SAC 0307 solder joint on printed circuit board (PCB)
with ENiG surface finish (electroless nickel immersion gold) towards
shock waves resulting from an open-field blast test. Micromechanical
properties changes were investigated using nanoindentation approach.
The solder joints were exposed to shock wave test using different
doses of Emulex, 700 g and 1500 g, respectively. The solder joint's
hardness has decreased 29% from 141 MPa to 100 MPa after subjected
to shock wave using 1500 g Emulex. The shock wave has led to the
changes in micromechanical properties of the solder joints in terms
of softening behaviour i.e. the decreasing of hardness and reduced
modulus values. However, no cracks were observed between solder-substrate
indicate that the solder joint is not fail and remains strong after
subjected to high shock wave, despite the significant reduction
in micromechanical properties.
Keywords: Micromechanical properties; nanoindentation; shock wave;
solder joint; solder materials Sn-Ag-Cu
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*Pengarang untuk surat-menyurat;
email: maria@ukm.edu.my
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