Sains Malaysiana 45(8)(2016): 1275–1279

Nanoindentation Approach on Investigating Micromechanical Properties of Joining from Green Solder Materials

(Kaedah Perlekukan Nano dalam Mengkaji Sifat Mikromekanik Sambungan Bahan Aloi Pateri Hijau)

 

MARIA ABU BAKAR1, AZMAN JALAR1,2*, ABDUL RAZAK DAUD2, ROSLINA ISMAIL1,

NUR AZIDA CHE LAH3 & NAJIB SAEDI IBRAHIM4

 

1Institute of Microengineering and Nanoelectronics (IMEN), Universiti Kebangsaan Malaysia

43600 Bangi, Selangor Darul Ehsan, Malaysia

 

2School of Applied Physics, Faculty of Science and Technology, Universiti Kebangsaan Malaysia

43600 Bangi, Selangor Darul Ehsan, Malaysia

 

3Fabrication & Joining Section, Universiti Kuala Lumpur Malaysia France Institute, Section 14, Jalan Teras Jernang, 43650 Bandar Baru Bangi, Selangor Darul Ehsan, Malaysia

 

4Redring Solder (M) Sdn. Bhd., Lot17486, Jalan Dua, Taman Selayang Baru, 68100 Batu Caves, Selangor Darul Ehsan, Malaysia

 

Diserahkan: 20 April 2015/Diterima: 12 Januari 2016

 

ABSTRACT

This work investigates the micromechanical properties of Sn96.5Ag3.0Cu (SAC 305) on Immersion Tin (ImSn) surface finished after subjected to high temperature storage (HTS) at 180°C for 200 to 1000 h period. Nanoindentation approach was used to measure the micromechanical properties of the solder. It was observed that the indentation depth and plastic depth were increased and a clear trend of decreasing hardness as opposed to the increasing reduced modulus as the HTS time lengthened. The plasticity-asscociated properties become stronger meanwhile the elasticity-associated properties decreased with the HTS time. These findings indicate that nanoindentation approach can clearly determine the plastic and elastic deformation occurance throughout the test.

 

Keywords: Lead-free solder; micromechanical properties; nanoindententation

 

 

ABSTRAK

Penyelidikan ini mengkaji sifat mikromekanik Sn96.5Ag3.0Cu (SAC 305) pada substrat dengan kemasan permukaan rendaman timah (ImSn) selepas didedahkan pada penyimpanan suhu tinggi (HTS) pada suhu 180°C selama 200 hingga 1000 jam. Kaedah perlekukan nano digunakan untuk mengukur sifat mikromekanik aloi pateri. Didapati bahawa kedalaman perlekukan dan plastik meningkat dan terdapat tren kekerasan yang jelas menurun bertentangan dengan modulus terkurang dengan pemanjangan masa HTS. Sifat berkaitan plastik menjadi semakin kuat dan sebaliknya bagi sifat elastik yang menurun dengan pemanjangan masa HTS. Keputusan menunjukkan pendekatan menggunakan kaedah perlekukan nano dapat mengenal pasti kewujudan canggaan plastik dan elastik sepanjang uji kaji.

 

Kata kunci: Pateri bebas plumbum; perlekukan nano; sifat mikromekanik

 

 RUJUKAN

Abdullah, S., Yunoh, M.F.M., Kamarudin, H. & Jalar, A. 2009. Role of strain rate on the micromechanical characterization properties of 4N gold micro wire: Micro tensile and nanoindentation. European Journal of Scientific Research 28(1): 33-43.

Bui, Q.V. & Jung, S.B. 2014. Evaluation of mechanical properties of low-Ag ball grid array solder joints using a high-speed ball shear test. J. Alloys Comp. 589: 590-595.

Yoon, J.W., Kim, S.W. & Jung, S.B. 2007. Effect of high temperature storage test on reliability of eutectic Sn–Cu/ ENIG solder joint. Mater. Sci. Tech. 23(4): 411-416.

Karamouz, M., Azarbarmas, M., Emamy, M. & Alipour, M. 2013. Microstructure, hardness and tensile properties of A380 aluminum alloy with and without Li additions. Mater. Sci. Eng. A 582: 409-414.

Kim, H., Kang, M., Jung, H.J., Kim, H.S., Bae, C.M. & Lee, S. 2013. Mechanisms of toughness improvement in Charpy impact and fracture toughness tests of non-heat-treating cold-drawn steel bar. Mater. Sci. Eng. A 571: 38-48.

Lee, C.B., Jung, S.B., Shin, Y.E. & Shur, C.C. 2002. Effect of isothermal aging on ball shear strength in BGA joints with Sn-3.5Ag-0.75Cu solder. Materials Transactions 43(8): 1858-1863.

Moharrami, N. & Bull, S.J. 2014. A comparison of nanoindentation pile-up in bulk materials and thin films. Thin Solid Films 572: 189-199.

Oliver, W.C. & Pharr, G.M. 1992. An improved technique for determining hardness and elastic modulus using load and displacement sensing indentation experiments. J. Mater. Research 7(06): 1564-1583.

Ramos, N.M.M., Simoes, M.L., Delgado, J.M.P.Q. & Freitas, V.P.D. 2012. Reliability of the pull-off test for in situ evaluation of adhesion strength. Construction and Building Materials 31: 86-93.

Sauli, Z., Retnasamy, V., Vairavan, R., Khalid, N. & Abdullah, N. 2014. Wire bond shear test simulation on flat surface bond pad. Procedia - Social and Behavioral Sciences 129: 328-333.

Siviour, C.R., Walley, S.M., Proud, W.G. & Field, J.E. 2005. Mechanical properties of SnPb and lead-free solders at high rates of strain. J. Phys. D: Appl. Phys. 38: 4131-4139.

Tsukamoto, H., Nishimura, T., Suenaga, S. & Nogita, K. 2010. Shear and tensile impact strength of lead-free solder ball grid arrays placed on Ni (P)/Au surface-finished substrates. Mater. Sci. Eng. B 171: 162-171.

Wang, H.S., Su, Y.Z., Jang, J.S.C. & Chen, H.G. 2013. A comparison of crystallization behaviors of laser spot welded ZreCueAgeAl and ZreCueNieAl bulk metallic glasses. Mater. Chem. Phys. 139: 215-219.

Yeh, M.K. & Huang, T.H. 2014. Drop test and finite element analysis of test board. Procedia Eng. 79: 238-243.

Zulkifli, M.N., Jalar, A., Abdullah, S., Rahman, I.A. & Hamid, M.A.A. 2013.  Strength distribution of Au ball bond using nanoindentation approach. Mater. Sci. Eng. A 577: 189-196.

 

 

*Pengarang untuk surat-menyurat; email: azmn@ukm.edu.my

 

 

 

 

sebelumnya