Sains Malaysiana 36(1): 53-57 (2007)

Borophosphosilicate Glass (BPSG) Reflow Characterization

For  Submicron CMOS Technology

(Pencirian Kaca Borophosphosilicat(BPSG) bagi Teknologi Submikron CMOS)

Uda Hashim, Ramzan Mat Ayub & Nik Hazura N. Hamat

Micro Fabrication Cleanroom, School of Microelectronic Engineering

Kolej Universiti Kejuruteraan Utara Malaysia

02000 Kuala Perlis, Perlis, Malaysia

ABSTRACT

This paper involves the planarization of borophosphosilicate glass (BPSG) film using a new recipe for annealing process to improve the borophosphosilicate glass (BPSG) film flatness after reflow. This improvement is for 0.35µm technology using steam annealing method at different temperatures. This process allows the planarization of wafers with thin layer at its surface. In this paper we present the comparison between the effect of hydrofluoric acid (HF) staining on the cross sectional topography with the samples without hydrofluoric acid (HF) staining analyzed by field emission scanning electron microscopy (FESEM). We found that staining with HF produced clearer images.

Keywords: borophosphosilicate glass; steam annealing; hydrofluoric acid staining

ABSTRAK

Kajian ini melibatkan pensatahan filem kaca borophosphosilicat (BPSG) dengan menggunakan suatu resipi baru proses sepuh lindap bagi memperbaiki kerataan filem tersebut selepas proses pengaliran semula. Pembaikan ini diaplikasikan bagi teknologi 0.35µm menggunakan teknik sepuh lindap stim pada suhu yang berbeza. Proses ini membolehkan pensatahan wafer dengan filem nipis pada permukaannya. Kertas kerja ini memfokuskan perbandingan di antara sampel yang dicelupkan di dalam asid hidrofluorik (HF) dan sampel yang tidak dicelupkan ke dalam asid hidrofluorik (HF) yang dianalisis menggunakan field emission scanning electron microscopy (FESEM) dan didapati sampel yang dicelupkan di dalam asid hidrofluorik memberikan imej yang lebih jelas.

Kata kunci: kaca borophosphosilikat; sepuhlindap stim; pencelupan asid hidrofluorik

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